LQDX to present its Low-Cost Glass Substrate/TGV metallization method at IMAPS DPC, March 3-6 Phoenix AZ.
February 26, 2025
No Comments
Read More »
LQDX and Arizona State University Sign Semiconductor Packaging Collaboration Agreement.
February 6, 2025
No Comments
Read More »
LQDX Latest Technology Featured at the Ultra High Density Interconnect Symposium.
January 21, 2025
No Comments
Read More »
Join LQDX and partners Alconix Corp. and Toyal Foil at TPCA Taiwan 2024.
October 19, 2024
No Comments
Read More »
So You Want To Be an Interconnectologist? A Conversation with Simon McElrea of LQDX.
September 25, 2024
No Comments
Read More »
LQDX Awarded “Top Semiconductor Manufacturing Company 2024” by Semiconductor Review
August 20, 2024
No Comments
Read More »
LQDX and Kansai Denshi Industries Sign Sales and License Agreement
June 20, 2024
No Comments
Read More »
LQDX to be featured at the 74th Electronic Components and Technology Conference (ECTC)
May 28, 2024
No Comments
Read More »