We are proud to be an exhibitor at the 75th Anniversary of the Electronic Components and Technology Conference (ECTC), held this year at the Gaylord Texan Resort & Convention Center, Dallas, TX, May 27–30, 2025. Come see us at Booth #234, where we will be showcasing test results from our newest LMI® (Liquid Metal Ink) product, our collaborative work with Arizona State University, and our associated fine pitch metallization work on:
Glass Core Panels with High-Aspect Through Glass Vias
FOWLP with Additive-SAP vs. PVD Redistribution Layers
Sub-Micron Pitch ABF® IC-Substrates with Deep Trenches
Feel free to drop by or contact us in advance at info@lqdx.xom to book an appointment.
Find out what our PVD-in-a-BottleTM solutions can do for you.
