As a Gold Sponsor, LQDX is also hosting the 3DIncites Backyard Olympics networking event.
LQDX is proud to announce its participation as a gold sponsor and presenter at the 21st Annual Device Packaging Conference (DPC 2025) taking place from March 3-6, 2025, in Phoenix, Arizona. Hosted by the International Microelectronics Assembly and Packaging Society (IMAPS), DPC 2025 is a premier international forum for knowledge exchange in the field of semiconductor device packaging, bringing together scientists, engineers, academics, and industry leaders.
LQDX will, for the first time and in collaboration with Arizona State University, be presenting its low-cost/low-temperature copper metallization process for glass substrates with high-aspect ratio Through-Glass Vias (TGVs) and sub-micron IC-substrate patterning, all directed towards the next generation of high-performance Panel Level Packaging.
Sue Kao, LQDX Principal Engineer, will present the study, including work by Siyang Liu of ASU, entitled:
“METALLIZATION OF HIGH-ASPECT RATIO VIAS ON ADVANCED IC-SUBSTRATES USING A NOVEL LIQUID METAL INK on Tuesday, March 4, 2025, 3:00 – 3:30 PM
The paper explores the novel and simple metallization technique that has been reduced to practice in glass-core and advanced organic substrates, and will discuss the material, process, reliability and integration considerations required to implement the process in volume production.
