The 74th Electronic Components and Technology Conference (ECTC) is a premier conference that covers all of the latest developments in the semiconductor packaging sector. Held this year in Denver, Colorado, we will be showcasing our innovative solutions at booth #704. Our engineering and executive team will be on hand to answer all of your questions about Liquid Metal Ink® and how LQDX can deliver incredible performance and value that will empower the next generation of heterogeneous integration. We are a member of the Executive Committee organizing the conference, and will be participating in a couple of notable key events: On Tuesday, May 28, LQDX will be on a special panel entitled "Substrate-Scaling Challenges in Chiplet Integration." We will also be helping to organize and chair a special start-up challenge on Thursday, May 30, "The Future of Semiconductor Industry. Emerging Start-ups and Material Innovations in Advanced Packaging." This is an event you don’t want to miss.
About The Event
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT).
The technical program contains papers covering leading edge developments and technical innovations across the packaging spectrum. Topics include advanced packaging, modeling and simulation, Photonics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies. Both poster and presentation formats are used. Special papers presented at the ECTC will be awarded the Intel Best Student Paper Award and best and outstanding paper awards.
The Panel, Plenary, Special Sessions, and EPS Seminar provide the conference participants the opportunity to gain the insight and perspective of technical and business leaders.
