LQDX is honored to have our latest work on multi-layer Ultra-HDI PCBs and IC-Substrates presented by Jason Schipp and Andrew Alvarez of the Naval Surface Warfare Center (NSWC Crane) at this year’s Ultra High Density Interconnect Symposium. LQDX is also proud to be one of the Premier Sponsors of the event in Peoria, Arizona – home of the new TSMC and Amkor plants and of Baseball’s Spring Training! The presentation will take place on Thursday, January 23rd 3:30pm in the Main Hall of the Peoria Sports Complex. For more information visit https://smta.org/mpage/uhdi/
About the Ultra HDI Symposium:
As the semiconductor industry pushes towards smaller, more powerful technologies to meet demands for increased performance and ever-smaller feature sizes, the Ultra High Density Interconnect Symposium offers exclusive access to the latest advancements in PCB Design, Fabrication, Assembly, and Reliability.
This Year’s Event will Spotlight:
- Lab-to-Fab Updates: Key insights and forward-looking action items stemming from SMTAi 2024 Ultra HDI Learning Pavilion discussions.
- Miniaturization in Assembly: Solutions to the growing challenges shrinking feature sizes.
- PCB Fabrication Breakthroughs: New materials, processes, and equipment transforming Ultra HDI.
- DFM & Signal Integrity: Strategies for optimizing design with ultra-thin PCB materials and ensuring signal integrity, with a focus on DFM’s role for both fabrication and assembly.
- Future Technologies: A look at emerging innovations LCP with 10-micron embedded traces and sub-5-micron features on next-generation materials.
