The 74th Electronic Components and Technology Conference (ECTC) is a premier conference that covers all of the latest developments in the semiconductor packaging sector. Held this year in Denver, Colorado, we will be showcasing our innovative solutions at booth #704. Our executive team will be on hand to answer all of your questions about Liquid Metal Ink® and how LQDX can deliver incredible performance and value that will empower the next generation of heterogeneous integration. We are a member of the Executive Committee organizing the conference, and will be participating in a couple of notable key events: On Tuesday, May 28, LQDX will be on a special panel entitled "Substrate-Scaling Challenges in Chiplet Integration." We will also be helping to organize and chair a special start-up challenge on Thursday, May 30, "The Future of Semiconductor Industry. Emerging Start-ups and Material Innovations in Advanced Packaging." This is an event you don’t want to miss.
About The Event
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT).
